Senior Process Development Engineer (Backend)

Job Description

Summary

Join a world leader and innovator in semiconductor and photonic device manufacturing as a Process Engineer. This role offers the opportunity to contribute to new process development, continuous process improvement, new product introduction (NPI), scrap reduction, cycle-time improvement, and operational support within a state-of-the-art semiconductor fabrication facility based at our Caswell site.

Technology Areas

Thin Film Deposition

Develop, optimise, and maintain dielectric thin-film deposition processes for passivation, optical confinement, device protection, and anti-reflective coatings. Support ALD, PECVD, sputtering, and related deposition technologies to achieve target film thickness, uniformity, refractive index, stress, and reliability requirements. Drive process capability improvements and support new product introduction activities.

Metal Deposition

Develop, optimise, and maintain metallization processes for ohmic and Schottky contact formation in semiconductor and photonic devices. Support sputtering, ion beam deposition, thermal evaporation, electron-beam evaporation, and electroplating processes. Improve film quality, adhesion, contact resistance, process repeatability, and manufacturing yield while supporting technology development and production operations.

Backend Wafer Processing

Develop and optimise backend wafer processing operations including wafer mounting, thinning, back grinding, chemical mechanical polishing (CMP), polishing, cleaving, and dicing. Support thin-wafer handling, process qualification, yield improvement, and manufacturing scale-up activities. Drive continuous improvement initiatives to enhance throughput, wafer quality, and device reliability.

Key Responsibilities

• Maintain and continuously improve production processes.
• Develop and qualify new semiconductor manufacturing processes.
• Analyse process and equipment data using SPC, Six Sigma, and statistical methodologies to drive continuous improvement.
• Perform equipment qualification and cross-qualification activities to ensure continuity of supply, increase capacity, and reduce cycle times.
• Prepare and review technical documentation, operating procedures, engineering reports, and training materials.
• Ensure high levels of equipment availability through effective process control and tool monitoring strategies.
• Analyse, interpret, and respond to product and process data in a timely manner.
• Apply Lean Manufacturing techniques to improve process performance, yield, and operational efficiency.
• Collaborate closely with Product Engineering, Equipment Engineering, Manufacturing, and R&D teams to support new product introduction and technology transfer.
• Support fault finding, recovery, and performance improvement of process equipment.
• Lead or participate in yield improvement, defect reduction, and cost-reduction initiatives.
• Meet individual and team objectives within a fast-paced manufacturing environment.
• Work in a semiconductor cleanroom environment, performing wet etching processes while adhering to safety protocols.
• Utilise a variety of software applications, including specialist semiconductor manufacturing and data analysis systems.
• Adhere to all site health, safety, and environmental procedures.

Education/Qualifications/Skills/Competencies:

• HNC/HND, Bachelor's Degree, Master's Degree, PhD, or equivalent industrial experience in Semiconductor Technology, Materials Science, Physics, Chemistry, Chemical Engineering, Electronic Engineering, or a related discipline.
• Experience in semiconductor, photonics, compound semiconductor, MEMS, optoelectronics, silicon photonics, or other advanced manufacturing environments is highly desirable.
• Knowledge of SPC, DOE, Six Sigma, Lean Manufacturing, and root cause analysis methodologies.
• Strong analytical, problem-solving, and communication skills.
• Ability to work independently and collaboratively within multidisciplinary teams.
• Ability to work with minimal supervision whilst ensuring that all tasks are completed.
• Competent PC user (including the use of Microsoft Office).
• Knowledge of photonic integrated circuit manufacture would be an advantage
• Working within a high-technology manufacturing or production environment is an advantage.
• Knowledge of manufacturing execution systems (MES).

Job Challenges:

• You will work within a multi-disciplined team from a wide range of backgrounds and a broad skills base to solve challenging problems with real commercial impact.
• You will provide a professional quality of work in a cost and time conscious environment.
• You will develop an in-depth knowledge of a wide variety of semiconductor manufacturing processes.
• The role presents significant opportunities for personal development and immediate contribution.

Other Requirements:

• Attention to detail.
• Ability to work under pressure, alone or as a part of a team.
• Excellent attendance, timekeeping, and punctuality.
• Self-motivated and dependable with good communication skills.
• Must have a professional attitude to work and colleagues.
• A flexible approach to work and customer demand.
• The normal working pattern on weekdays with the flexibility to work at other times if the business requires. Able to work on shift if needed