Our cutting edge client is currently searching for a Packaging Engineer to join the photonics operations team.  The role will involve working with engineering and product development teams to specify required packaging solutions required for volume manufacture. Working with vendors to select and qualify assembly processes will be required as well as coordinating day to day management of external vendors.

Required skills for the Packaging Engineer will include :

• Experience with assembly packaging techniques including dicing, die attach, flip chip, wire bonding etc
• Knowledge of semiconductor device manufacturing steps and high-volume testing and packaging and product development.
• Photonics packaging experience desirable
• Strong communication skills
• Master’s degree in a relevant technical field

Please contact Rachel Anderson for further details.